The most technologically advanced X-ray inspection systems on the market
08 Apr 2011
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is pleased to announce that its award-winning high resolution X-ray inspection systems will be exhibited in Booth 1625 at the IPC Printed Circuits Expo and APEX Designers Summit scheduled to take place on 12 - 14th April 2011 in Las Vegas, Nevada.
Nordson DAGE’s flagship systems use the latest technology, flat panel detector to provide the ultimate choice for the highest quality real time X-ray imaging. The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 100 nanometer (0.1µm) feature recognition and up to 10 watts of power, together with the 3 mega pixel long lifetime CMOS flat panel detector makes these systems the crystal clear choice for the greatest performance and highest magnification of real-time imaging.
These Nordson DAGE systems can be equipped with a µCT option providing computerized tomography (CT) 3D modeling and volumetric measurement of solder joints making them ideally suited for analytical investigation of solder interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package devices.