Aylesbury, Buckinghamshire, UK – November 2011 - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), are proud to announce the launch of X-Plane™.
This revolutionary option for their range of industry-leading X-ray inspection systems uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve.
Dr. David Bernard, Nordson DAGE Product Manager - X-ray Systems said “Standard 2D X-ray views of today’s double-sided PCBs can be difficult to interpret and analyze, as the joints from both sides of the board, and within multi-layer devices, such as the package on package, can overlap in the image. To combat these limitations, the X-Plane™ option uses the standard Nordson DAGE X-ray systems to simply and easily separate all these different layers, as well as producing slices in any other planar view. But most importantly, X-Plane™ can do all this over an 18” x 16” inspection area and without needing to cut the board.”