Nordson DAGE Announces New Materials Test Capability

Market leader in bond test technology moves into Materials testing market

24 Nov 2011

Aylesbury, Buckinghamshire, UK – November 2011 - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announced its new Materials testing capability on the 4000Plus at the Productronica  exhibition held in Munich, Germany 15th – 18th November 2011 – Hall A2 – Stand 339.

Designed to support the materials testing needs of the microelectronics market, from static testing to fatigue, the 4000Plus has the flexibility required to characterize the mechanical properties of individual bonds, devices and circuit boards. The user interface is preconfigured for each type of test, providing ease of setup and flexibility of test.

A wide range of measurement data is collected for each cycle of the test which can later be analyzed or exported using the comprehensive set of tools available in Nordson DAGE’s Paragon™ software. Paragon’s fatigue software covers bend testing of boards and devices to simulate strains experienced in thermal fatigue, through to lifetime testing of connectors.

With high load capability and well proven accurate positioning and measurement, this makes the 4000Plus the ideal choice for today’s more demanding users.

Nordson DAGE also provides bespoke test solutions which cater for unique properties and designs in order to aid end product testing.