The latest news from Nordson DAGE


Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum
(03 Mar 2015)

Nordson’s Hal Hendrickson Appointed to the IPC APEX Exhibitor Committee
(12 Feb 2015)

Nordson DAGE X-ray Systems Announces European Distributor of the Year 2014
(28 Nov 2014)

Nordson DAGE Announces Further Orders for its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester
(17 Nov 2014)

Nordson DAGE Announces Latest Order for XM8000 and Attendance at IWLPC
(04 Nov 2014)
The Fastest Fully Automatic X-ray Metrology tool for Wafer Bumps and TSV’s

Nordson DAGE Awarded a Global Technology Award for Camera Assist Automatic Bondtesting at SMTA International
(22 Oct 2014)
2nd Award for this Core Application

Nordson DAGE Launches the Xi3400 Automated X-ray Inspection System
(05 Sep 2014)

Nordson DAGE Appoints Richard Frisk as European Sales Manager for Inspection Products
(01 Sep 2014)

Dr. Evstatin Krastev from Nordson DAGE to Present Two Ground-breaking X-ray Inspection Studies during the Technical Sessions at SMTAI 2014
(05 Aug 2014)

Nordson DAGE Accepts a 2014 NPI Award for Camera Assist Automatic Bondtesting at APEX
(14 Apr 2014)

Nordson DAGE Expands into New Research and Development Facility
(25 Feb 2014)

Nordson DAGE Launches the XM8000 Wafer X-ray Metrology Platform
(17 Jan 2014)
Unprecedented levels of precision, detection and throughput for fully automated wafer measurement of TSV’s, 3D packages and wafer bumps

Nordson DAGE Continues Its ‘Performance Beyond Expectations’ with a 2013 Global Technology Award
(21 Nov 2013)
Second Award Presented to Nordson DAGE at Productronica 2013

Nordson DAGE Brings ‘Performance Beyond Expectations’ to Productronica 2013
(08 Nov 2013)
Nordson DAGE will be showcasing its new 2nd Generation 4000Plus Bondtester on Stand A2:438 together with its award winning X-ray Inspection systems

Nordson DAGE Appoints Cabiotec as its Distributor for X-ray Inspection Systems in Italy and Malta
(18 Oct 2013)

Nordson DAGE to Exhibit the Ruby X-ray Inspection System at SMTA International
(27 Sep 2013)
The best choice for Printed Circuit Board Assembly (PCBA) inspection

Experts from Nordson DAGE and Nordson YESTECH to Present at Joint Cleaning Workshop in Dallas
(29 May 2013)

Nordson DAGE Accepts SMT China Vision Award
(07 May 2013)

New and Improved Technical Specification for the Nordson DAGE XD7800 Ruby XL X-ray Inspection System
(10 Dec 2012)
Specifically designed for Large Area Printed Circuit Boards

Nordson DAGE Win Two 2012 Global Technology Awards
(18 Oct 2012)
Nordson DAGE’s New X-Plane™ Technology wins its Third Industry Award in the Category of Software – Production. The XD7500VR Jade FP X-ray inspection system is named Best Asian Product

Quick Links


IMAPS Arizona
(17 Mar 2015-18 Mar 2015)
Nordson DAGE Bond Test will be exhibiting at this event

SMTA Dallas, TX
(24 Mar 2015-24 Mar 2015)
Nordson DAGE and Nordson YESTECH will participate in this event

Nepcon China 2015
(21 Apr 2015-23 Apr 2015)
Visit Nordson DAGE and Nordson YESTECH in Booth No. B-1F28

(05 May 2015-08 May 2015)

SMT Hybrid Packaging 2015
(05 May 2015-07 May 2015)

ECTC 2015
(28 May 2015-31 May 2015)
Nordson DAGE Bond Test will exhibit at this event

Semicon West 2015
(14 Jul 2015-16 Jul 2015)