Area Array Technology is now part of mainstream electronics. However, the availability of inspection criteria and practical hands on training to help production staff determine reliable solder joints is limited. The assembly process for BGAs is fairly well understood for tin/lead, but for lead-free assembly there are still critical issues to consider during inspection. This is also true with Quad Flat No Lead (QFN), Land Grid Array (LGA), Package on Package (PoP) and now with the introduction of Bottom Mounted Components (BMC) remains an issue to many companies struggling with a new range of process defects.
Presented by Bob Willis the workshop will cover X-ray inspection of solder joints for both tin/lead and lead-free terminations. It will also compare X-ray images with optical examples and include an introduction to the lead-free assembly process with specific attention to BGA and area array devices, illustrating the most common process failures. In addition it will provide a step-by-step guide to the procedure of inspection for optical and X-ray inspection criteria on different lead-free terminations and pad surfaces.
Delegates will receive inspection posters and a copy of A Practical Guide to X-ray Inspection Criteria and Common Defect Analysis co-written with Bob Willis by Dr David Bernard, Product Manager X-ray Systems Nordson DAGE. There will also be the opportunity to win inspection CD-ROMs. Delegates may also bring a sample board or components for analysis during the workshop for free advice on the quality or possible cause of process failure.
For further details and a booking form go to http://www.askbobwillis.com/faworkshops.pdf.
Blundell Production Equipment
Units C/D, Quinn Close, Seven Stars Industrial Estate
Coventry. CV3 4LH
Tel: 02476 210270
Fax: 02476 210280
www.blundell.co.uk
sales@blundell.co.uk