Dr David Bernard of Nordson DAGE to Present X-ray Inspection Technology Paper at SMTA International 2011

Defining the optimum system configurations for best X-ray inspection analysis

06 Sep 2011

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. David Bernard, Product Manager – X-ray Systems will present a paper entitled “The Implications of Recent Technology Advances for X-Ray Inspection in Electronics” at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.  The presentation will be held during session PRC1, concerning Non-destructive Inspection and Analysis Methods, which will take place Wednesday, October 19, 2011 from 2:00-3:30pm in room 104.  Dr. Bernard co-authored the paper with his Nordson DAGE colleague, X-ray Systems Global Sales Director, Keith Bryant.

Taking X-ray images goes back over 100 years.  Since then, there have been numerous advances in terms of X-ray tube and X-ray detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been rapidly driven by the continued reduction in board, device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components.

This presentation will review the various X-ray tube and detector types that are available and explain the implications of these choices for electronics inspection in terms of what they provide for inspection regarding image resolution, magnification, tube power, detector pixel size and the effects of detector radiation damage, amongst others. It will also suggest optimum configurations for the main electronics inspection tasks required today.

The ability to inspect and analyze components, substrates, solder pastes and solder joints is an important capability for any assembly operation. On-going process monitoring helps prevent problems and failure analysis capability helps fix problems. Real time, non-destructive methods such as X-ray, acoustic micro-imaging and optical inspection are preferred for their ability to provide timely feedback without destroying the product. This session will cover advancements in these inspection and analysis methods from a user and supplier perspective