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X-Ray Inspection Systems and Bond Test Equipment

Nordson DAGE was founded in 1961 and is a market leading provider of award winning bond test and x-ray inspection systems for destructive and non-destructive mechanical testing and inspection of electronic components.

Nordson DAGE has developed a wide range of capabilities and solutions to cater for the testing requirements from across a broad spectrum of industries.

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Bondtesters

Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond testing technology.

Recognized as the industry standard Nordson DAGE has a truly global presence and takes pride in delivering support to both local and international organizations alike.

NEW Wafer Testing Solutions Brochure

View our New Materials Testing Video

4000Plus Bondtester

Paragon Software

4000 Multipurpose

4000HS High Speed 

4000W Wafer Handling  

4300 Series

4500 Series

Vision Systems

X-ray Systems

Nordson DAGE's award winning X-ray systems have been specifically and ergonomically designed for Printed Circuit Board assembly (PCB) and semiconductor industries   not only within failure analysis laboratories but also within the production environment

Aerospace & Military
XD7600NT Diamond FP
XD7600NT Diamond
XD7600NT Ruby FP
XD7600NT Ruby
XD7800NT Ruby XL for larger boards

Computer Tomography
CT option

Failure Analysis and Laboratory work
XD7600NT Diamond FP
XD7600NT Diamond

PCB Assembly
XD7600NT Ruby FP
XD7600NT Ruby
XD7800NT Ruby XL for larger boards
XD7500VR Jade FP

Semiconductor and high technology applications
XD7600NT Diamond FP
XD7600NT Diamond
XD7800NT Ruby XL for larger boards

 

XD Series Comparison Chart

 

Events

Electronics and Automation
(28 May 2013-30 May 2013)
Nordson DAGE will be exhibiting with their distributor Partnertec

ECTC
(29 May 2013-30 May 2013)
Visit Nordson DAGE in Booth No. 416

Semicon West
(09 Jul 2013-11 Jul 2013)
Visit Nordson DAGE and Nordson YESTECH in Booth No. 5971

IMAPS USA
(29 Sep 2013-03 Oct 2013)

ISTFA
(13 Nov 2013-14 Nov 2013)