X-Ray Inspection Systems and Bond Test Equipment

Nordson DAGE was founded in 1961 and is a market leading provider of award winning bond test and x-ray inspection systems for destructive and non-destructive mechanical testing and inspection of electronic components.

Nordson DAGE has developed a wide range of capabilities and solutions to cater for the testing requirements from across a broad spectrum of industries.

Bondtesters

Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Micro Materials Testing

With over 30 years' experience in small geometry testing, Nordson DAGE is a pioneer in micro materials testing offering unrivalled expertise and capability across a range of materials and applications.

Wafer X-ray Metrology

The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions

X-ray Systems

Nordson DAGE's award winning X-ray inspection systems have been specifically and ergonomically designed for the circuit board (PCB) and semiconductor industries offering high resolution nano-focus X-ray systems for both failure analysis labs and the production environment.

Bondtesters

Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond testing technology.

Recognized as the industry standard Nordson DAGE has a truly global presence and takes pride in delivering support to both local and international organizations alike.

NEW Wafer Testing Solutions Brochure

View our New Materials Testing Video

4000Plus Bondtester

Paragon Software

4000 Multipurpose

4000HS High Speed 

4000W Wafer Handling  

4300 Series

4500 Series

Vision Systems

X-ray Systems and Platforms

NEW Xi3400 - Automated X-ray Inspection System

 

NEW SOFTWARE UPGRADES NOW AVAILABLE -

Upgrade to Windows 7

Upgrade to Windows 7 plus X-Plane


NEW X-RAY WAFER METROLOGY PLATFORM -
The Nordson DAGE XM8000

Nordson DAGE's award winning X-ray systems have been specifically and ergonomically designed for Printed Circuit Board assembly (PCB) and semiconductor industries   not only within failure analysis laboratories but also within the production environment

Aerospace & Military
XD7600NT Diamond FP
XD7600NT Diamond
XD7600NT Ruby FP
XD7600NT Ruby
XD7800NT Ruby XL for larger boards

Computer Tomography
CT option

Failure Analysis and Laboratory work
XD7600NT Diamond FP
XD7600NT Diamond

PCB Assembly
XD7600NT Ruby FP
XD7600NT Ruby
XD7800NT Ruby XL for larger boards
XD7500VR Jade FP

Semiconductor and high technology applications
XD7600NT Diamond FP
XD7600NT Diamond
XD7800NT Ruby XL for larger boards

 

XD Series Comparison Chart