Medical Electronics Media

Chip encapsulation with dual valves

Many medical devices have RF communication chips and need RF shield. “Dam and fill” is used for the RF shield material chip encapsulation. 

Solder paste dispensing

Medical devices have very condensed component allocations. Nordson ASYMTEK SV-100 dispenser can put solder paste on specific locations between tight distances of components.  

Close up underfill fluid capillary

Medical device suppliers leverage Asymtek underfill machine dispense underfill.

Simultaneous underfill dispensing with dual jets

Dual jets increase underfill UPH.