Underfill for Electronic Component Assembly Media

Jetting Underfill with the DJ-9500

Jets can access between die in narrow spaces. Fast underfill with 2 short passes for CSPs.

Jetting underfill between die with the DJ-9500

Using a twin-die demo part, the DJ-9500 jets underfill quickly and accurately in the 1-mm space between each die on the twin-die demo parts.

Enables high-speed underfill, shown on Spectrum S-920N with DJ-9500

Thin substrate with 192 die. Fiducial capture and 2-pass underfill = 170 seconds, less than 1 second per die. At the end, very slow motion (25% normal speed) shows underfilling flow out.

Finding 400 fiducials 5x faster than standard stop & capture mode

Finding 400 fiducials 5x faster than standard stop & capture mode, 16.85 seconds versus 88.02 sec.