Technical Papers
Managing the Underfill Process in Transient Thermal Environments (large die underfill)
S. Adamson, D. Ashley, W. Hassler, J. Wilburn (IMAPS Device Packaging Conference 2009) (PDF 314 KB)
Enabling High Density System In Package (SiP) Manufacturing And Consumer Electronic Devices Through The Use Of Jetting Technology To Minimize Substrate Area For Underfill
M. Peterson, Belton Technologies, S. Adamson, Asymtek (SMTAI 2006) (PDF 407 KB)
Paradigm Shift in Applying Underfill
A. Babiarz (Pan Pacific Jan 2005, Hawaii) (PDF 511 KB)
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces
S. Adamson (APEX 2004) (PDF 230 KB)
Jetting Technology: A Way of the Future in Dispensing
H. Quinones, A. Babiarz, L. Fang (EMAP, Taiwan, October 2002) (PDF 170 KB)
Jetting Technology for Microelectronics
H. Quinones, A. Babiarz, L. Fang (IMAPS Nordic, Stockholm, Sweden September 2002) (PDF 197 KB)
Evaluation of Printed Circuit Board layout for Chip Scale Packages that Require Underfill and the Effect of Adjacent Passive Components
S. Adamson, J. Klocke, L. Nielsen (Pori Engineering Conference, June 2001) (PDF 138 KB)
Underfill Processes for Large to Small Flip Chips
A. Babiarz, H. Quinones, B. Ciardella (Pan Pacific, Kauai, HI, February 2001) (PDF 176 KB)
Advances in Fast Underfill of Flip Chips
A. Babiarz, H. Quinones (ICEP/Microelectronics, Tokyo, Japan, February 2001) (PDF 200 KB)
Encapsulation of Large, Densely Populated Die with Small Gap
H. Quinones, T. Ratledge, D. Padgett, B. Huey (IMAPS UK, London, UK January 2001) (PDF 49 KB)
Controlling Fillet Size in Underfill Process
Alan Lewis, Christian Q. Ness, Brian Verrilli (February 1999) (PDF 80 KB)
Articles
Jetting Small Dots of High Viscosity Fluids for Packaging Applications
A. Babiarz (Seminconductor International, August 2006) (PDF 688 KB)
Eliminating Underfill Voids: Troubleshooting Underfill Void Elimination and Methods for Gaining Reliability in Underfill Applications
A. Lewis (Advanced Packaging Magazine, September 2005) (PDF 273 KB)
Jet Dispensing - The Underfill Solution
T. Woods, Plexus, S. Adamson, Asymtek (SMT Magazine, January 2005) (PDF 336 KB)
Hotsheets
Jetting Underfill Between Two Dissimilar Die (Ablestik UF8828)
(ASH-033, May 2008)
Jetting Underfill on Flex into a Small Gap, 0.4 x 0.5 mm (Henkel Loctite 3536)
(AHS-032, May 2008)
Jetting Emerson & Cuming Underfill Materials
(AHS-023, May 2007)
Jetting Underfill into Tight Tolerances, 350-μm gap
(AHS-006, March 2006)