Semiconductor Equipment from Nordson ASYMTEK

Semiconductor Packaging

Nordson ASYMTEK’s products enable precision dispensing processes used in Semiconductor Packaging for Flip Chips, Wafer level packages, Package on Package (PoP’s), System in Package (SiP’s) and 3D package assemblies and many other types of Semiconductor Packaging.

Featured Semiconductor Packaging

Flip Chip Underfill - Nordson ASYMTEK
Flip Chip Underfill

With Calibrated Process Jetting (CPJ) technology, Nordson ASYMTEK’s dispensing systems automatically manage the critical processes for underfill weight consistency making them ideal for the flip chip underfill process.

3D Packaging

Dispensing applications for stacked dies with outer-edge interconnection , stacked dies with through silicon vias (TSV) and face-to-face stacked dies

Thermal Compounds from Nordson ASYMTEK
Thermal Compounds

Specialize in dispensing high viscous and wear compounds.

Non-Conductive Paste (NCP) and No Flow Underfill

High speed jetting for enhanced no-flow deposition pattern dispensing.

Lid Seal from Nordson ASYMTEK
Lid Seal

Dispensing is used to create a seal of material into which a lid is placed.

Die Attach Dispensing from Nordson ASYMTEK
Die Attach Dispensing

Jet dispensing of die bonding paste is much faster than conventional needle dispensing. Patterns of the past can be dispensed that cannot be achieved with a needle dispenser.

Chip Encapsulation and Cavity Fill from Nordson ASYMTEK
Chip Encapsulation and Cavity Fill

Simple, inexpensive method of protecting a chip or die and wirebonds.

Dam and Fill Dispensing from Nordson ASYMTEK
Dam and Fill Dispensing

A method of encapsulating wire bonds and die that results in a flat top finish for printing.

BGA Solder Ball Reinforcement from Nordson ASYMTEK
BGA Solder Ball Reinforcement

Simple method to improve solderball reliability by applying a polymer around the balls prior to assembly.

Selective Flux Jetting from Nordson ASYMTEK
Selective Flux Jetting

Fast deposition of flux coatings in the micron range, with good edge coating.