Selective Flux Jetting from Nordson ASYMTEK

Selective Flux Jetting

Fast deposition of flux coatings in the micron range, with good edge coating.

Nordson ASYMTEK's Flux Jetting systems provide a consistent film thickness for flip Chip reflow applications. With film coatings as thin as 2 microns with low viscosity flux materials.

Flux jetting technology can also be used to produce thin coatings of phase change tacky flux materials.

Ideal for flip chip and area array type connections using a C4-type reflow process. Flux jetting can significantly improve throughput on a flip chip assembly line by moving the flux operation from the pick and place system and performing the fluxing task prior to pick and place.

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