Lid Seal from Nordson ASYMTEK

Lid Seal

Dispensing is used to create a seal of material into which a lid is placed.

Lid Seal dispensing is the final dispensing process in semiconductor package assembly. With Fluidmove software from Asymtek you can program weight-controlled beads of sealant to ensure a consistent seal operation. Asymtek’s range of versatile systems can be set up to dispense most polymeric sealants  with a 1% @3sigma repeatability.

Nordson ASYMTEK systems can also be used with many solder paste materials for lid seal applications.

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Akira Morita     
Semiconductor Packaging      Market Specialist     

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