Lid Seal dispensing is the final dispensing process in semiconductor package assembly. With Fluidmove software from Asymtek you can program weight-controlled beads of sealant to ensure a consistent seal operation. Asymtek’s range of versatile systems can be set up to dispense most polymeric sealants with a 1% @3sigma repeatability.
Nordson ASYMTEK systems can also be used with many solder paste materials for lid seal applications.