Die Attach Dispensing from Nordson ASYMTEK

Die Attach Dispensing

Jet dispensing of die bonding paste is much faster than conventional needle dispensing. Patterns can be dispensed that cannot be achieved with a needle dispenser.

Nordson ASYMTEK's technology has proven ideal for dispensing the electrically conductive materials and non-conductive epoxies used for critical die-attach operations.

Die attach fluids like silver epoxy can be deposited by either standard needle dispensing or by jetting, depending on the application. Contact Asymtek for more information.

Using programmable dispensing patterns and precise volume control, Nordson ASYMTEK systems deliver excellent die-attach results for chip-on-board (COB) and multi-chip module (MCM) applications. PCB assembly customers can readily integrate Nordson ASYMTEK dispensing systems into their chip-level die attach operations, while tailoring the dispense process to meet production requirements.

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Akira Morita     
Semiconductor Packaging      Market Specialist     

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