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Fluid Dispensing Systems

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  • Solutions
  • Semiconductor Packaging
  • Underfill for Electronic Component Assembly
  • Selective Flux Jetting
  • BGA Solder Ball Reinforcement
  • Dam and Fill Dispensing
  • Chip Encapsulation and Cavity Fill
  • Die Attach Dispensing
  • Lid Seal
  • Non-Conductive Paste (NCP) and No Flow Underfill
  • Thermal Compounds
  • 3D Packaging

Dam and Fill Dispensing Recommended Equipment

Batch

Dispensing System

  • Spectrum S-820 Series

Jets, Pumps, Valves

  • DispenseJet DJ-9500
  • DV-8000 Heli-Flow

Options and Accesssories

  • Dual Action Dispesning
  • Low Fluid Sensor
  • Needle Heater
  • Impingement Tooling
  •  

Inline

Dispensing System

  • Spectrum S-920N

Jets, Pumps, Valves

  • DispenseJet DJ-9500
  • DV-8000 Heli-Flow

Options and Accessories

  • MH-900 Loaders/Unloaders
  • Dual Action Dispesning
  • Laser Height Sensor
  • Low Fluid Sensor
  • Needle Heater
  • Pre-Queue Station
  • Fids-on-the-Fly
  • Controlled Process Heat (CpH)
  • Impingement Tooling

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