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Dam and Fill Encapsulation for Microelectronic PackagesS. Adamson, C. Ness (Nepcon West, February 1999) (PDF 311 KB)
Jetting Encapsulant Dam Material, Hysol FP4651(AHS-028, April 2008)
Dam and Fill Encapsulation for Microelectronic PackagesJetting Encapsulant Dam Material, Hysol FP4651