Chip Encapsulation and Cavity Fill from Nordson ASYMTEK

Chip Encapsulation and Cavity Fill

Simple, inexpensive method of protecting a chip or die and wirebonds.

Chip encapsulation on PCBs, lead frames, ceramic substrates and cavity packages requires an accurate amount of encapsulation material to protect the chip in semiconductor packaging and other applications. Encapsulation materials are usually made of epoxy but sometimes other materials are used, like silicones.

Nordson ASYMTEK has valves and jets to choose from that can dispense all materials used in chip encapsulation. The valves and jets range from simple time-pressure types to auger valves, to high-speed, high-accuracy jets.

Describe  your encapsulation application and Nordson ASYMTEK has a valve and system to meet your requirements, from R&D lab to production.

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Akira Morita     
Semiconductor Packaging      Market Specialist     

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