Technical Papers
Jetting Fluids in a Wide Variety of New Electronics And Semiconductor Non-Traditional Packaging and Assembly Applications
A. Babiarz (Pan Pacific, January 2009) (PDF 1.1 MB)
Jet Dispensing Underfills for Stacked Die Applications
S. Adamson (MEPTEC 2004) (PDF 365 KB)
Encapsulation Technology for 3D Stacked Packages
H. Quinones, A. Babiarz, L. Fang (ICEP Microelectronics, Tokyo, Japan, April 2002) (PDF 211 KB)
Articles
Dispensing Processes for Underfill of Package on Package Assemblies
H. Quinones, B. Sawatzky, L. Rolland (EMAsia magazine, March 2008) (PDF 12 MB)
Design Considerations for Package on Package Underfill
B. Perkins (Advanced Packaging magazine, Dec 2008) (PDF 561 KB)
Hotsheets
Jetting Underfill for Package on Package (PoP), Zymet X21101
(ASH-014, May 2006)
Jetting Silver Epoxy Lines Vertically & Diagonally on Stacked Packages
(AHS-039, May 2008)