Surface Mount Adhesive Library

Technical Papers

Fluid Dispensing Processes for Next Generation Electronics
H. Quinones (Pan Pacific, Hawaii 2003) (PDF 196 KB)

Jetting Technology: A Way of the Future in Dispensing
H. Quinones, A. Babiarz, L. Fang (EMAP, Taiwan, October 2002) (PDF 170 KB)

Jetting Technology for Microelectronics
H. Quinones, A. Babiarz, L. Fang (IMAPS Nordic, Stockholm, Sweden September 2002) (PDF 197 KB)

Advantages of Non-Contact Dispensing in SMT Assembly Processes
A. F. Piracci (SMTA/ATE, Chicago, IL, September 2000) (PDF 91 KB) 
Practical Production Applications for Jetting Technology
A. F. Piracci (APEX 2000, Long Beach, CA, March 2000) (PDF 992 KB)


Process Improvements in Fluid Dispensing
D. Ashley (US Tech Magazine, July 2012) (PDF 212 KB)

Successful Jetting in SMT 
D. Ashley, A. Lewis (SMT Magazine, May 2007) (PDF 278 KB) 
Jetting - Dispense Technology of Choice for Adhesives
A. Lewis (SMT Magazine, March 2006) (PDF 322 KB)