Nordson ASYMTEK's in-line, SMEMA-compatible and batch dispensers are fully programmable, single-point dispensing platforms that easily adapt to most production requirements for accuracy, speed and process carrier design. These versatile platforms can also be converted to dispense other materials such as thermal compounds and lid sealants.
A range of field-proven auger valves allows for a wide selection of paste materials. Nordson ASYMTEK's Heli-Flow™ Series Pump with closed-loop velocity control delivers consistent dot volume.
Low-force height sensing delivers accurate and consistent dispense height control for excellent dot repeatability.
High-speed solder paste dispensing is useful in many production scenarios:
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Solder deposition in recessed areas in the PCB
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Addition of paste after printing, common with RF shielding and boards with large & small deposit requirements
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BGA/QFN repair
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Deposit of paste on semi populated boards
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R&D testing, before printing stencil is designed
- High mix, low volume production, eliminating need for screen printing