Nordson ASYMTEK's in-line, SMEMA-compatible and batch dispensers are fully programmable, single-point dispensing platforms that easily adapt to most production requirements for accuracy, speed and process carrier design. These versatile platforms can also be converted to dispense other materials such as thermal compounds and lid sealants.
A range of field-proven auger valves allows for a wide selection of paste materials. Nordson ASYMTEK's Heli-Flow™ Series Pump with closed-loop velocity control delivers consistent dot volume.
Low-force height sensing delivers accurate and consistent dispense height control for excellent dot repeatability.
High-speed solder paste dispensing is useful in many production scenarios:
Solder deposition in recessed areas in the PCB
Addition of paste after printing, common with RF shielding and boards with large & small deposit requirements
Deposit of paste on semi populated boards
R&D testing, before printing stencil is designed
- High mix, low volume production, eliminating need for screen printing
To ensure a successful solder paste dispensing process, keep these facts in mind:
- Solder paste ideal loading: 84 to 86% metal by weight.
- Dots smaller than 300 microns typically require paste type 5 or 6 and 28 to 30 gauge needle.
- Controlling the dispense gap is very important. If PCBs are warped, additional process control, like a height sensor, will probably be required.
- Nordson ASYMTEK offers systems that are capable of dispensing solder paste in a wide range of operations including production, labs and R&D, and on many surfaces, including recesses.
- These systems can be configured with either the DV-7000 auger valve or the piezo-driven SV-100 Slider ValveTM depending on your specific solder paste application. Choose the platform that best meets your production requirements – from batch (like the SpectrumTM S-820) to inline systems (SpectrumTM S-910N).
To read more about solder paste dispensing:
Advancements in Solder Paste Dispensing
D. Ashley, S. Adamson (SMT Magazine, July 2008) (PDF 500 KB)
Formulation Considerations for Automated Dispensing of Lead Free Solder Paste
A. Lewis (2003) (PDF 254 KB)