Package on Package (PoP)

Jetting underfill for PoP devices ensures high UPH with small wet out zones and enables simultaneous underfill of top & bottom packages

3D packaging and assembly help utilize surface area and volume contained within a product. As more and more features are added, the surface of a PCB is densely populated to a point where actives and passive no longer fit onto a single surface. By stacking memory packages on top of the logic packages, called “Package on Package”, the PCB surface area can be reduced to make smaller products. Jetting enables simultaneous underfill of both top & bottom package to protect the assembly from shock & vibration.

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Dan Ashley     
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