3D packaging and assembly help utilize surface area and volume contained within a product. As more and more features are added, the surface of a PCB is densely populated to a point where actives and passive no longer fit onto a single surface. By stacking memory packages on top of the logic packages, called “Package on Package”, the PCB surface area can be reduced to make smaller products. Jetting enables simultaneous underfill
of both top & bottom package to protect the assembly from shock & vibration.