Fluid Dispensing Systems
Jets, Pumps and Valves
Conformal Coating Equipment and Accessories
Fluid Dispensing Accessories and Options
SMT and PCB Assembly
Flat Panel Display Assembly
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Flexible, integrated coating and curing systems, with choice of applicators, provide precise coating with process controls and traceability. The result is cost savings, increased throughput and productivity.
No-flow underfill fluids can be dispensed with traditional needle dispensing but also jetted using our award-winning DispenseJet valve with patented co-axial air assist.
By embedding actives and passives beneath the surface of a PCB, more functionality can be added without increased PCB size. Nordson ASYMTEK offers dispensing solutions for many embedded assembly applications
Jetting underfill for PoP devices ensures high UPH with small wet out zones and enables simultaneous underfill of top & bottom packages
Corner and edge bonding are being used as an alternative to underfill to add mechanical strength and reliability to BGAs and similar chip-scale packages (CSPs). Nordson ASYMTEK offers techniques for dispensing fluids for corner bonding
Solder mask dispensing is a cost-effective alternative in high-mix, low-volume environments. Nordson ASYMTEK systems adapt to changing requirements, such as masking leads in a single dispense pass or masking multiple boards at the same time.
Using Asymtek’s dispensing systems to jet electrically conductive epoxy-based fluids will enhance the speed of die placement equipment. The exceptional accuracy delivers significant cost-of-material savings.
As technologies like flip chip and CSP migrate into high-volume production, sustainable throughput and consistent quality are critical factors. The efficient application of flux in precise, thin patterns is crucial to maximizing throughput and quality
Non-contact jet dispensing is ideal to underfill CSPs, BGAs, and PoP packages on boards. With Control Process Jetting, Nordson ASYMTEK's jetting systems automatically manage the critical processes related to underfilling
Discrete devices require fast, accurate deposition of solder paste. Our in-line, SMEMA-compatible and batch dispensers are fully programmable, single-point dispensing platforms that easily adapt to most production requirements.
Jetting surface mount adhesive offers advantages over traditional techniques. Many PCB designs demand higher speeds and greater accuracy than traditional time/pressure dispensing systems and more flexibility than screen printing.
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