Encapsulation and Cavity Fill

Cavity packages provide a readymade, simple method of packaging many types of devices from integrated circuits to MEMS

Maximizing throughput is achieved by optimizing the volumetric accuracy, flow rate, and fill patterns of the dispensing process. Nordson ASYMTEK's DP Series Linear Pump and proprietary fill-pattern technology create the highest throughput cavity-fill dispensers available today.

Superior volumetric control delivers accurate fill heights for consistent wirebond coverage and fill flatness.

The DP Series Linear Pump delivers 1%, 3 sigma repeatability for a typical shot size of 300 mg, despite changes in fluid viscosity.

Contact and non-contact part-heating options, either contact or impingement, offer maximum flexibility.

Related Products

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Flexible Impingement-Heat ToolingFlexible Impingement-Heat Tooling

Impingement heat ensures precise and consistent substrate heating for reliable fluid dispensing when contact heating is not an option.

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Akira Morita     
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