Fluid Dispensing Systems
Jets, Pumps and Valves
Conformal Coating Equipment and Accessories
Fluid Dispensing Accessories and Options
SMT and PCB Assembly
Flat Panel Display Assembly
Contact Nordson ASYMTEK
The Spectrum™ S-822 Series fluid dispensing system is designed for semiconductor and electronics packaging applications, such as chip scale package (CSP) underfill, cavity fill, die attach, and encapsulation. S-822 is standalone with dual-shuttle stages
The Spectrum S-820-C Class 100 Cleanroom dispenser is specifically designed for applications that are sensitive to contamination by submicronsized particles. The system provides advanced dispensing process capability, and is ideal for labs.
The Spectrum™ S-820B Series system is designed for batch production of semiconductor packaging processes, such as underfill, cavity fill, die attach, and encapsulation. It's ideal for labs, batch production, and new product development.
The Spectrum™ S-810 Series is designed for batch production of advanced dispensing applications that do not require substrate heat. The S-810 provides advanced dispensing process capability in an affordable package, and is ideal for labs.
The next level of refinement, the Quantum® Q-6800 Series is Nordson ASYMTEK’s latest high-performance, large-format dispensing platform.
The scalable Spectrum™ II S2-920C Cleanroom series is specifically designed for Class 100 environments and for applications that are sensitive to contamination by submicron-sized particles, such as wafer-level packaging.
The vented Spectrum™ II S2-930 inline dispensing system provides exceptional accuracy and reliability for selectively jetting low-viscosity flux (and some high-tack fluxes) and other precise coating materials.
The Spectrum™ II S2-920 series fluid dispensers feature integrated, closed-loop process controls to ensure consistent, high production yield for the most challenging underfill applications.
The Spectrum™ II S2-910 series fluid dispensers continue Nordson ASYMTEK’s tradition of providing high value products to meet customers’ assembly and packaging requirements in both today’s packages as well as future developments.
The DispenseMate® Series brings dispensing power to a compact package. In a benchtop format, many of today’s advanced automated dispensing features are included with the basic model platform.
The Spectrum S-930N inline dispensing system provides exceptional accuracy and reliability for selectively jetting low-viscosity flux (and some high-tack fluxes) and other precise coating materials
The Spectrum S-922N is a high-volume dual lane dispensing system for advanced electronics packaging and semiconductor assembly.
With its flexible, scalable configuration, the Spectrum S-920N series is the ideal choice for a wide variety of dispensing applications. It can be configured with single or dual lanes, and up to six heat stations with the dual-lane configuration.
The scalable Spectrum™ S-920N-C Series Cleanroom dispensers are specifically designed for Class 100 environments and for applications that are sensitive to contamination by submicron-sized particles, such as wafer-level packaging.
Spectrum S-910N/S-912N fluid dispenser -- ideal for inline, high-volume applications that do not require heat like surface mount adhesive, silver epoxy, solder paste, and edge- and corner-bonding applications
The Spectrum S-922N-LED dual-lane LED Cavity Encapsulation dispensing system is faster than competitive dual-auger and multi-head air-over valve systems and is easier to setup and operate.
© 2014 Nordson Corporation