Fluid Dispensing Systems
Jets, Pumps and Valves
Conformal Coating Equipment and Accessories
Fluid Dispensing Accessories and Options
SMT and PCB Assembly
Flat Panel Display Assembly
Contact Nordson ASYMTEK
The Spectrum S-930N inline dispensing system provides exceptional accuracy and reliability for selectively jetting low-viscosity flux (and some high-tack fluxes) and other precise coating materials
The Spectrum S-922N-LED dual-lane LED Cavity Encapsulation dispensing system is faster than competitive dual-auger and multi-head air-over valve systems and is easier to setup and operate.
The Spectrum™ S-820 Series system is designed for batch production of semiconductor packaging processes, such as underfill, cavity fill, die attach, and encapsulation. It's ideal for labs, batch production, and new product development.
The Spectrum S-822 dispenser is designed for semiconductor and electronics packaging processes, such as chip scale package (CSP) underfill, cavity fill, die attach, and encapsulation. It is a standalone system with dual-shuttle stages
The DispenseMate Series brings new dispensing power to a compact package. In a benchtop format, many of today's advanced automated dispensing features are available. It is ideal for batch processing or prototyping.
Spectrum S-910N/S-912N fluid dispenser -- ideal for inline, high-volume applications that do not require heat like surface mount adhesive, silver epoxy, solder paste, and edge- and corner-bonding applications
With its flexible, scalable configuration, the Spectrum S-920N series is the ideal choice for a wide variety of dispensing applications. It can be configured with single or dual lanes, and up to six heat stations with the dual-lane configuration.
The Spectrum S-922N is a high-volume dual lane dispensing system for advanced electronics packaging and semiconductor assembly.
The scalable Spectrum™ S-920N-C Series Cleanroom dispensers are specifically designed for Class 100 environments and for applications that are sensitive to contamination by submicron-sized particles, such as wafer-level packaging.
© 2013 Nordson Corporation