This technology utilizes high-frequency, piezoelectric-drive actuation to quickly deposit small dots of thick fluids like solder paste and silver-filled epoxies. Lever action aligns valve seats to open a smooth path for fluid flow. Within milliseconds, the holes are forced out of alignment to stop fluid flow, and a dot is formed. The SV-100 is fast and accurate for a range of production requirements, including solder paste dots for passive components smaller than 0603, rework of BGA electrical connections, lines and patterns for RF shield attach, or unique patterns of conductive epoxy.
Features
Up to 20% faster than auger dispensers- 20000 dots per hour (1 mm grid)
- Dot & Line deposition capability
- Compatible with lead free and no clean solder pastes
- Small diameter paste dispensing for passive components (0402, 0201)
- Ideal for BGA re-work, when screen printing is not an option
- Dots < 300 µm with type 4, 5 & 6 pastes
- Compatible with Silver filled Epoxies
- Compatible with off-the-shelf needles
- Resistant to plugging
- Complements screen printing when SMT component mix requires large variation in dot sizes or difficult to print dot sizes
Recommended Applications
Recommended Platforms
- S-820 Spectrum™ Precision Batch Semiconductor Dispenser
- D-580 DispenseMate® Benchtop Dispensing System
- X-1010 Axiom™ SMT Dispenser
- X-1020 Axiom™ Semiconductor Dispenser
- X-1020-C Axiom™ Cleanroom Dispenser
- X-1022 Axiom™ Semiconductor Dual-Lane Dispenser
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