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DJ-9000 Series DispenseJet
Underfill printed circuit board.
Dual DJ-9000 Series DispenseJets
Dual-Simultaneous Micro Coating cellphone printed circuit board.
36.5K UPH with S-922N and MH-900 for LED cavity encapsulation
Combination of active nozzle jetting, dual jets, dual lanes and same-side loader/unloader achieves 36.5K UPH for 4mg phosphor silicone cavity encapsulation on lead frames: LF5630.
LED Encapsulation with phosphor. Dual lanes with same side feed with the MH-900 loader/unloader on the Spectrum S-920N.
CSP Edge Bonding on the Spectrum S-910N.
Simultaneous underfill top and bottom levels of a package-on-package (PoP).
Dual-Simultaneous Underfill on the Spectrum S-920N dispenser.