DispenseMate D-580 Series Media

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D-585 & Heli-Flow Series Valve - Solder Paste MEMS Application

Heli-Flow series offers broad range of applications from small dot, sealing, dam, and, encapsulation.

This video demonstrates uniform thin line sealing application for MEMS packaging.  Optimized line speed of 25mm/s was used in this video using solder paste material.




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