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Dual-action dispensing enables dispensing of two fluids with a combination of jet and/or valves. The two applicators operate independently. Dual-action dispensing is ideal for applications that require two different materials dispensed on the same part. Examples include dam and fill encapsulation and hybrid applications that require both conductive and non-conductive die attach epoxy. Dual-action dispensing is also recommended for high-mix production when several product types are manufactured during the same shift.
The Axiom X-1010 system meets mid-range throughput requirements for inline, high-volume, high-accuracy SMT application of surface mount adhesive, solder paste, and electrically conductive adhesive applications.
The Axiom™ X-1020 system is designed to meet high-volume dispensing requirements for inline semiconductor package and printed circuit board assembly. The X-1020 system offers precise control over positioning accuracy using sealed glass linear encoders.
Nordson ASYMTEK's Axiom X-1020 cleanroom dispensing series is specifically designed for Class 100 cleanrooms and for applications that are extremely sensitive to contamination by submicron sized particles, such as wafer-level packaging.
The Axiom X-1022 is a high-volume dual lane dispensing system for advanced electronics packaging and semiconductor assembly. It is ideal for applications like flip chip and CSP underfill when more than one underfill pass is required.
The DispenseMate Series brings new dispensing power to a compact package. In a benchtop format, many of today's advanced automated dispensing features are available. It is ideal for batch processing or prototyping.
Spectrum S-910N/S-912N fluid dispenser -- ideal for inline, high-volume applications that do not require heat like surface mount adhesive, silver epoxy, solder paste, and edge- and corner-bonding applications
With its flexible, scalable configuration, the Spectrum S-920N series is the ideal choice for a wide variety of dispensing applications. It can be configured with single or dual lanes, and up to six heat stations with the dual-lane configuration.
The Spectrum™ S-820 Series system is designed for batch production of semiconductor packaging processes, such as underfill, cavity fill, die attach, and encapsulation. It's ideal for labs, batch production, and new product development.
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