Fluid Dispensing Equipment for Printed Circuit Board Assembly & Advanced Semiconductor Packaging


Nordson ASYMTEK supplies fluid dispensing and conformal coating equipment that are supported by a global service network. Recognized for our innovative dispenser and coating systems, we offer customer-inspired solutions in a range of industries.

PCB Assembly

Nordson ASYMTEK designs and manufactures a full line of automated precision fluid dispensers and selective conformal coating systems, supported by an award-winning network.

Alternative Energy

Nordson ASYMTEK's automated fluid dispensing systems are ideal for a range of applications for the manufacturing and assembly of photovoltaic cells, fuel cells and other products that support alternative energy resources.

LED Assembly

For LED packaging, Nordson ASYMTEK's systems precisely dispense silicone, phosphor silicone mix, underfill, thermally conductive adhesive, conformal coating and epoxy encapsulation.

FPD Assembly

Nordson ASYMTEK supplies automated dispensing systems for one-drop fill (ODF), UV and gasket seals writing, filling clear protective materials and other processes for OLED, LCD and touch panel assembly.

Electromechanical

The manufacturing of MEMS, RFID devices, hard disk drives and other electromechanical assemblies benefit from Nordson ASYMTEK's automated precision dispensing and conformal coating systems.

Life Science

Nordson ASYMTEK's products precisely jet, coat and dispense reagents and other fluids during manufacturing operations for medical devices, point-of-care device assembly, lab-on-a-chip assembly and medical electronics.

Semiconductor Packaging

Nordson ASYMTEK's products enable precision assembly processes for component packaging and advanced semiconductor packaging for flip chips, 3D packages, wafer-level packages, PoPs, SiPs and others.

News

Nordson ASYMTEK's NexJet System Wins Two Technology Innovation Awards
(12 May 2013)
EM Asia-China and SMT China magazines conferred the awards at NEPCON China 2013

Nordson ASYMTEK Technology Days 2013 to Highlight Technological Developments in Fluid Dispensing, Jetting, and Conformal Coating
(01 May 2013)
Register for June 12 and 13 event held in The Netherlands

Nordson ASYMTEK Demonstrates Dual-Action Underfill at NEPCON China Booth #1F61
(18 Apr 2013)
Throughput increased 60-85% for electronics packaging applications like flip-chip underfill, chip encapsulation, and thermal compounds

Nordson ASYMTEK Demonstrates Precision Dispensing and Coating at SMT Hybrid Packaging
(12 Apr 2013)
Nordson ASYMTEK Demonstrates Precision Dispensing and Coating at SMT Hybrid Packaging, smartTec Stand #7-219, and participating in Future Packaging Line for electronics with NexJet System

Nordson ASYMTEK Wins Service Excellence and New Product Introduction Awards
(06 Mar 2013)
Recognized for Service Excellence 9 times in 10 years, and for new NexJet System

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Events

Electronics & Automation 2013
(28 May 2013-30 May 2013)
See Nordson ASYMTEK in Jaarbeurs Utrecht, The Netherlands - booth #8E001

SEMICON Russia 2013
(05 Jun 2013-06 Jun 2013)
Nordson ASYMTEK will be represented by partner OSTEC in booth #301 - Moscow

NEPCON Malaysia 2013
(10 Jun 2013-12 Jun 2013)
Nordson ASYMTEK will be at NEPCON Malaysia with partner Transtec

ACI Technologies Free Workshop Series - June 2013
(11 Jun 2013-11 Jun 2013)
Nordson ASYMTEK will be presenting on BGA underfill at the ACI Technologies workshop series in Philadelphia, Pennsylvania, USA

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Workshops & Seminars

Technology Days 2013
12 Jun 2013 - 13 Jun 2013

Nordson ASYMTEK announces sixth Technology Days event. The Technology Days 2013 will be held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht, The Netherlands