Carlsbad, CA, USA – Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, announces that Steven J. Adamson, Nordson ASYMTEK marketing specialist, was honored with IMAPS' 2010 President's Award for dedicated efforts in ensuring a successful reorganization of the IMAPS Microelectronics Foundation and increasing its financial resources. IMAPS (International Microelectronics And Packaging Society) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging.
Adamson has been an active member of IMAPS for many years. He was chairman of the San Diego IMAPS chapter for two years and general chairman of the 2006 IMAPS International Symposium on Microelectronics. He served as IMAPS president in 2008. In 2009 Adamson volunteered to be chairman of the IMAPS Microelectronic Foundation. This organization is devoted to helping students and academia participate in IMAPS activities through grants and awards. To achieve this goal the Microelectronics Foundation, under the leadership of Adamson, organized and ran numerous fund-raising activities.
"Steve has a passion for the Society, for the success of the Society, and for the proliferation of the Society (IMAPS)," said Howard Imhof, Advanced Coatings Division manager for Metalor Technologies USA and 2010 IMAPS president. "Following a recently completed 3-year sequential term as president elect, president, and 1st past president --each with separate, but significant, responsibilities to a 4000+ international membership – Steve volunteered to chair the IMAPS Educational Foundation in 2010 which raises and distributes funds for University/College students to pursue microelectronic packaging & interconnect education and careers (Steve is also a valued member of the Global Business Council Steering Committee). Steve’s passion, leadership, and body of work for the society sets a peerless standard that I felt needed to be recognized during my term with the President’s Award – well deserved Steve, well done!"
"It is an honor and a surprise to receive this award," commented Adamson, "especially because I initiated the President's Award when I was IMAPS president. I am pleased to continue working for the IMAPS Foundation. It is a vital part of IMAPS as it gives students financial aid to attend industry seminars and events, meet and share ideas with others in the industry, and introduces them to IMAPS and the technical resources IMAPS can provide to them. It is an investment in the future of the microelectronics packaging industry. We will continue to look at ways to bring in funds for the Foundation, through golf tournaments, casino nights, and company-sponsored technical paper contests.”
Adamson has over thirty years experience in microelectronics assembly. An employee of Nordson ASYMTEK since 1998, he's held positions as applications engineering manager, and marketing specialist. He has worked in all aspects of packaging and assembly from R&D to manufacturing, designing multi-chip modules, hybrid circuits, printed circuit boards, thermal printed heads, and magneto-resistive head assemblies. He has delivered technical papers on wire bond encapsulation, chip scale package and flip chip assembly, PCB design rules, and reliability and has had papers published in leading industry trade journals both domestically and internationally. He is co-author with Charles Harper on a book titled, “Handbook of Plastic Processes,” published by McGraw-Hill.
Adamson previously held positions with Kodak, Motorola in the U.S., and Plessey, International Computers Ltd in the U.K. He has been awarded five US and two UK patents. In 2005 he was presented with an award by the San Diego Engineering Council for “Outstanding Service to Electrical Engineering”. Originally from the U.K., he holds a Higher National Certificate in Electrical Engineering from Stockport College of Technology and for several years was the lead instructor and advisor to the University of California San Diego (UCSD) extension course on Microelectronic and Optical Packaging.
About IMAPS (International Microelectronics And Packaging Society)
IMAPS leads the microelectronics packaging, interconnect and assembly community,
providing means of communicating, educating and interacting at all levels. The International Microelectronics and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain. Its events and products focus on those technologies critical to the present and future of microelectronics: 3D Integration, MEMS, Flip Chip, Wafer Level Packaging, Thermal Management, Printed Electronics, Advanced Materials, Photonics, Modeling/Design and many others. Find out more at www.imaps.org.
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