WESTLAKE, Ohio -- Leading technologies for producing high value-added products will be displayed at INTERNEPCON JAPAN trade show. Comprehensive coating, bond testing, inspection, dispensing, and plasma treatment solutions improve the manufacturing of mobile phones, tablet computers, laptops and other electronic devices.
Manufacturers throughout the world use Nordson Corporation equipment to perform a variety of critical processes in the assembly of printed circuit boards, semiconductor packages, camera modules, MEMS devices, LEDs, speakers, touch panels, keypads, displays, ear buds, and product housings.
The company will be demonstrating its latest technologies and product lines at INTERNEPCON JAPAN 2012, which will be held in Tokyo on January 18-20. Engineers and product specialists will be available at Booth 40-30 East (East Hall 5) to discuss attendees' manufacturing challenges, and demonstrate new ways to increase throughput and yields while reducing production costs.
Nordson's offerings at the show includes Nordson ASYMTEK's systems for dispensing, coating and underfilling on automated assembly lines. They will feature the Select Coat SC-280 Film Coater, which selectively coats complex circuit boards in seconds. By providing greater than 99 percent fluid transfer efficiency, it improves material utilization by 30 to 50 percent and minimizes the overspray, masking, and rework associated with conventional conformal coating processes.