IMAPS Device Packaging 2013

Nordson ASYMTEK to present, "Sealing Dispensing Requirements to Meet MEMS Packaging and Throughput Impact" in Scottsdale, AZ, USA

11 Mar 2013 - 14 Mar 2013

The paper by Ms. Heakyoung Park, "Sealing Dispensing Requirements to Meet MEMS Packaging and Throughput Impact,"  will be presented on March 12 at 11:30 AM during the MEMS and Microsystems TA3 session.
(Abstract below)

IMAPS 9th International Conference and Exhibition on Device Packaging
March 11-14, 2013
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

IMAPS Device Packaging show website


The MEMS industry has gained big momentum recently with significant unit growth, especially in the consumer market. While traditional MEMS devices like automotive accelerators have established high-volume manufacturing processes and packages with high reliability, most MEMS devices have been fragmented in packaging because of their unique requirements and small volumes, resulting in high packaging costs. In the cost-sensitive consumer market, devices such as MEMS microphones, accelerometers, and gyroscopes in mobile devices have rapidly increased their production volume and chased lower packaging cost while accepting relatively less reliability than traditional devices.

Sealing dispensing can be applied to device or cap wafer for wafer capping process.  Wafer capping protects active MEMS from dicing process after release because the additional cavity wafer with sealing covers the MEMS structure. There are manufacturing challenges because wafer capping requires precise alignment and a variety of bonding methods have technical drawbacks. Printing is one way to deposit sealing lines to cap wafers, but consumes a relatively wide area and may not work if the sealing line must go onto the MEMS die wafer. Sealing line can also be applied to organic substrate that contains MEMS device and ASIC and then lid is attached for bonding in cavity packages.

Previous paper covered technical requirements for dispensing sealant, volumetric accuracy, and motion systems to meet packaging trends and addressed manufacturing cost reductions. This paper will include investigating the impact on the throughput model due to size reduction efforts in packaging. More dies can be produced per given wafer size, which means there is more dispensing area per wafer. In addition, sealing line requirements will be more challenging, and so this paper will address these demands.