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X-Ray Technische Veröffentlichungen

Nordson DAGE personnel have presented technical papers and articles on X-ray in a variety of settings and this expertise is available for you to download

The Technical Papers have been grouped into the following categories:

Printed Circuit Board Assembly (PCBA)

Semiconductor Inspection & Assembly

X-ray Technology

 

Printed Circuit Boad Assembly (PCBA)

Use of digital X-ray imaging as a process control tool for lead-free PWB assembly

Lead-free Inspection Methods

Does PCB Pad Finish affect voiding levels in lead-free assemblies

Computerized Tomography meets the challenges of X-ray inspection

Correlating the presence of popcorned BGA devices post reflow with solder ball diameter measurements from X-ray Inspection

Common process identification of QFN packages using Optical and X-ray inspection

Using digital X-ray inspection for process control

Implications of using lead free solders on X-ray inspection of flip chips and BGA's 

Consideration for minimizing radiation doses to components during X-ray inspection

Selection criteria for X-ray inspection systems for BGA and CSP solder joint analysis

Modern 2D X-ray tackles BGA defects

Comparing Digital and Analogue X-ray inspection for BGA, Flip Chip and CSP analysis

Investigating voids

Quality and reliability of Printed Circuit Boad micro-vias by X-ray inspection

Non-destructive techniques for identifying defect in BGA joints; TDR, 2DX and cross-section/SEM comparison

 

 

Modern 2D/3D X-ray inspection - emphasis on BGA, QFN, 3D packages and counterfeit components

 

 

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