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Shinko - Electro Static Wafer Chucks

 

  • Material : Alumina ceramic
  • Dimension : Max size o450mm
  • Ceramic thickness : 0.8~15.0mm
  • Temperature : -20°C~ +300°C (We can correspond until 500°C)
  • Surface : We have the ability to offer Helium groove machining, emboss surface and optional surface roughness for wafer cooling by Helium

Semiconductor Applications

Chucks for Wafer Process

  • Dry Etching
  • Plasma Asher
  • HDP CVD
  • Sputter

FPD Applications

Chucks for FPD Process

  • Etching
  • ODF

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