CoorsTek

Gold Wire Ball-Wedge Bonding

Ceramic capillaries are used for ball-wedge bonding of Gold wires. CoorsTek offers proven series like 1513, 1570 or 1572 for standard tasks.
=> Capillaries

For Fine Pitch Bonding one can either add the option "Bottleneck", choose a capillary from the series 1590 – 1593, or choose a customized design. In addition we are happy to take your special bond parameters and formulate a suitable capillary.      
=> Fine Pitch Capillaries

The Ball Bumping series 1732 and 1733 are offered specially for flip chip applications where only a ball bond is required and no second bond.
=> Ball Bumping Catalogue page 038
=> Ball Bumping Catalogue page 039

CoorsTek offers different ceramic materials which are developed in house and manufactured starting with powder. Beside the white standard aluminium oxide ceramics there are three different ceramics grades that are reinforced with Zirconium. These result in pink capillaries. 
  

Wedge-Wedge Bonding

Maxiguide Wedges
For Wedge-Wedge bonding we recommend the standard Maxiguide series 2130 – 2160 with different wire feed angles from 30 ° to 60 °. They come along with a "Concave Face" for the bonding of aluminum wires.
The general recommendation for Gold Wire Bonding is: Flat Face with Cross Groove (F-CG). The cross groove feature provides a mechanical coupling for ultrasonic energy transmission between the wedge and the wire.
Because the standard material WC (Tungsten Carbide) reacts with Gold you should use TiC (Titan Carbide) or the more expensive option Black Cermet. This so-called  BKCER is a ceramic-metal alloy that exhibits a very rough and aggressive surface finish.                                                                               
=> Bond Wedges
=> Large Wire Wedges

MaxiBond Wedges
The patent pending MaxiBond series represents the next step in the design evolution of small wire wedges. It combines the advantages of both the Maxiguide  (good wire-guidance below the bond foot and the old V-notch series (access into small recessed pads and a complete back radius) by ignoring the disadvantage. This feature can be implemented into all small wire wedge series. 
=> MaxiBond & Deep Access Serie 4800

Deep Access Series
The series 4345 – 4660 was designed for bonding into deep cavity packages. The wire is fed vertically down the center of the tool, it exits down toward the bottom and re-enters through the wire feed hole at either a 45° or 60° angle. The wire clamp is located above the wedge.

Ribbon Wedges
If you want to bond ribbons instead of wires you may choose the series 2530, 2545, 2560 or the deep access version 4645R & 4660R. Please advice the ribbon thickness, width, and bond length and we specify the correct part number with the optimum slot dimensions. Here as well you can choose between the appropriate materials: WC, TiC and Cermet for Al- or Au ribbons.                  
=> Ribbon Tools

Welding Electrodes

Parallel Gap Electrodes
Various styles; the material is Molybdenum; suitable for Unitek and Hughes welders.
=> Welding Electrodes

Die Bonding

Die Collets
Two (series 3700) and four-sided (series 3800) collets are used to attach dice to a substrate using eutectic or epoxy attach methods. The collets are designed to pick up the die by the edges, not the face. Please advice the size and thickness of the die.
 
Pick-up Tools
The vacuum Pick-up Tools are typically used for die pick-and-place into epoxy. They have a flat round or rectangular photograph surface and are available in the materials WC or Delrin and Vespel.                                                                              
 
All die bond tools are available with Ø0.0625“/1,58mm or Ø0.125“/3,18mm or bonder specific shanks.
=> Die Bonding

Cleaning of Bonding Tools

Cut Tungsten Wires: 76 mm long Tungsten wires are available in many different diameters. With a pair of tweezers you should feed these thin wires from the back into the capillary and try to move out the contamination.
  
 
Unplugging Probes: These are small stable rods with a very sharp tip to remove any  remaining wire residue from the holes.
=> mechanical cleaning of Bonding Tools
=> chemical cleaning of Bonding Tools