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PCB assemblies manufacturing from Nordson.

PCB Assembly

Nordson YESTECH is a leading global provider of automated optical PCB inspection and high-resolution X-ray inspection systems. The full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the PCB assemblies market.

 

Manufacturers of advanced PCB assemblies equipment know that simultaneously producing cost-competitive products and meeting the quality expectations of customers are vital to their success. Driven by advancing board complexities and the desire to improve yields by effectively using real-time process information, manufacturers utilize the effectiveness of AOI (or automated optical inspection) PCB equipment and X-ray inspection technologies.

AOI PCB systems are essential in PCB production because they perform fast, repeatable, and accurate inspections, find and identify defects before in-circuit or final testing, reduce production costs, and improve quality. But AOI PCB systems can analyze only visible features. With the advent of BGAs, micro-BGAs, chip-scale packages (CSPs), flip chips and other hidden-connection devices, component and board manufacturers utilize X-ray systems to analyze the critical solder joints of these new-generation packages.

X-ray inspection is the best technology for identifying the PCB shorts, PCB voids, opens, misalignments and solder integrity of area-array chip packages.

 

Related Products

FX Series AOIFX Series AOI

The FX Series AOI offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

M1 Series AOIM1 Series AOI

The M1 AOI offers high-speed PCB inspection with exceptional defect coverage. With three megapixel resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide.

M1m AOIM1m AOI

The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With 3 micron pixel resolution and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter.

BX AOIBX AOI

The BX AOI offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

FX-UV AOIFX-UV AOI

The FX-UV makes inspection of conformal coatings simple and convenient by automating the inspection process for quality, consistency and thickness of coatings under UV lighting with the use of proprietary inspection algorithms.

BX-UV AOIBX-UV AOI

The BX-UV makes inspection of conformal coatings simple and convenient by automating the inspection process for quality, consistency and thickness of coatings under UV lighting with the use of proprietary inspection algorithms.

X3 3D X-RayX3 3D X-Ray

The X3 3D system permits users to discriminate between the top and bottom sides of boards. The X3 Automated X-Ray Inspection Systems (AXI) offer complete inspection of solder joints and other critical hidden features.

X2 2D X-RayX2 2D X-Ray

The versatile X2 2D Automated X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB’s and packaged semiconductors