Semiconductor & Wafer

Wafer Pre-Treatment

Plasma processing removes contamination and oxidation for increased reliability and bonding yields. Plasma also micro-roughens the wafer passivation layer for improved adhesion between the wafer passivation layer and BCB.

Contaminants - such as oxides, organics, and fluorides - are a growing concern as geometries decrease and the ratio between the contaminant and feature increases. The larger ratio results in reduced yield and reliability of the packaged product.

Related Products

TropoSPHERE Plasma Treatment SystemTropoSPHERE Plasma Treatment System

The TrophoSPHERE™ Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.

StratoSPHERE Plasma Treatment SystemStratoSPHERE Plasma Treatment System

The StratoSPHERE™ plasma system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability.

FlexTRAK Plasma Treatment SystemFlexTRAK Plasma Treatment System

The Nordson MARCH FlexTRAK™ series of gas plasma equipment provides unparalleled treatment uniformity and process consistency.