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Polymers, such as benzocyclobutene (BCB) and UBM, are dispensed on the wafer and act as a dielectric for the redistribution layer. Plasma treatment alters the topography and wettability of the wafer’s original passivation layer to promote adhesion.
The TrophoSPHERE™ Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
The StratoSPHERE™ plasma system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability.
The Nordson MARCH FlexTRAK™ series of gas plasma equipment provides unparalleled treatment uniformity and process consistency.
Surface Preparation for Improved Adhesion
Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination Using an Advanced Plasma Treatment System
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