The manufacture of thin film read/write heads for use in hard disk drives for data storage applications is a fast-growing subset of the MEMS market.
Typical plasma applications for the manufacture of these advanced devices includes device cleaning, photoresist descum, stripping of materials like photoresist and benzocylcobutene (BCB), etching redistribution lines, and removing contamination.
Applications include surface cleaning and roughening; chemical bond activation to improve bondability; and increasing wettability and uniformity of liquid flow over the wafer surface.
Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning |
Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion |
Dielectric Patterning | Via Cleaning | Bump Adhesion