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Medical Electronics

In the assembly of medical device microelectronics, Nordson MARCH's plasma treatment technology improves the pull strength & uniformity of bonds and modifies surfaces for better adhesion.

Featured Medical Electronics

Underfill for Medical Electronics

Plasma-enhanced surface preparation prior to the underfill process has proven to increase underfill wicking speed, increase fillet height and uniformity, minimize voiding, and improve underfill adhesion.

Encapsulation & Molding for Medical Devices

Plasma Treatment Solution - Encapsulation and Molding for Medical Device Manufacturing

Wire Bonding for Medical Devices

To ensure high device reliability and minimize manufacturing costs, it is important to optimize the wire bonding process to ensure good bond strengths and yields.