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To ensure high device reliability and minimize manufacturing costs, it is important to optimize the wire bonding process to ensure good bond strengths and yields.
Plasma-enhanced surface preparation prior to the underfill process has proven to increase underfill wicking speed, increase fillet height and uniformity, minimize voiding, and improve underfill adhesion.
Plasma Treatment Solution - Encapsulation and Molding for Medical Device Manufacturing
Plasma Processing for Optimal Medical Device Manufacturing
Surface Preparation for Improved Adhesion
Controlled Chemical Plasma Etching
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