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About Nordson
The FlexTRAK from Nordson MARCH offers high-throughput capability. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its unique slim structure minimizes floor space requirements.
The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
The FlexTRAK-WR system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter.
Surface Preparation for Improved Adhesion
Plasma-Enhanced Surface Modification Improves Production of Microelectronics