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MaxVIA Plasma Treatment System

MaxVIA Plasma Treatment System

Nordson MARCH’s MaxVIA™ System is specifically configured to meet the demands of today’s high throughput PCB manufacturing operations. Plasma treatment uniformity is a key operational feature in desmear and etchback applications for HDI, flexible and rigid circuit board manufacturing technologies.

The MaxVIA treatment system offers an expanded plasma chamber to accommodate large panel sizes - up to 24 x 42 inches - and has a high throughput capacity of 92 to 138 units per hour (UPH), depending on panel size.

The MaxVIA system platform is completely self-contained, requiring minimal floor space. The vacuum system, plasma chamber, control electronics, and 40 kHz power supply are housed in a single enclosure. Full front and rear access allows for convenient service to all interior components. The pump is positioned on rollers for easy removal. No side access is required allowing for even greater floor space savings. 

The MaxVIA system incorporates the best of Nordson MARCH’s market leading technology combined with novel application specific technology development based on our greater than 25 years of experience. Through extensive research and development, the MaxVIA system presents unique vacuum and gas flow technology, new electrode designs, and superior temperature management. The careful balance of these critical design elements and process recipe parameters delivers a system that creates the most uniform PCB treatment for key applications like desmear and landing pad cleaning.

The MaxVIA system’s superior performance capabilities are complemented by very attractive low-cost-of-ownership aspects. The system features a very compact and service-friendly design. The vertical loading concept and the use of easy loading carts minimizes any idle time which generates high levels of productivity. The fast vacuum pump down and greatly enhanced process cycle times further add to the throughput and productivity of the system.

Equipped with a touch-screen PC Operator Interface, the MaxVIA system provides a wide breadth of control capability and data collection. Unlimited recipes can be stored for easy switching of plasma processes from batch to batch. Password protection ensures that no unauthorized entries can be made.

Features and Benefits

  • High throughput of HDI, flexible and rigid panels for maximum production flexibility
  • Accommodates larger panel sizes within a small footprint to consume minimal floor space
  • Faster units per hour (UPH) processing to meet today’s demanding manufacturing schedules
  • Low CF4 gas consumption for desmear applications contributes to the lowest cost of ownership in its class
  • Patented system technologies produce superior process uniformity at high throughputs

Related Solutions

Carbon Removal
Nordson MARCH's plasma cleaning technology removes the carbon from conventional through-hole board vias & blind vias typically used on boards where component space is restricted.

Desmear & Etch Back
Nordson MARCH's plasma treatment technology removes epoxies, polyimides, high Tg blends, mixed materials & other resins more effectively than traditional methods of etching and desmearing

Non-Stick Surface Activation
Use plasma technology from Nordson MARCH for surface activation of double-sided and multi-layer fluoropolymer through-hole boards to increase surface wettability.

Residue Removal (Descum)
Nordson MARCH's plasma technology effectively removes resist residue from inner layers and panels as well as residual solder mask bleed for better bonding and solderability

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