FlexVIA™ Plasma Treatment System

FlexVIA Plasma Treatment System

The award-winning FlexVIA™ Plasma System from Nordson MARCH is a self-contained vacuum plasma system specifically designed for maximum efficiency and cost effective treatment of flexible materials. It features a space-saving, compact chassis with two easy-access, front-loading doors.

Efficient and Cost Effective

The FlexVIA System’s advanced horizontal electrode design, with integrated rack, provides optimum material alignment for industry leading plasma treatment uniformity. The dual-rack chamber accommodates up to (18) 20”x 24”panels in a single cycle.

Uniform plasma treatment of both sides of the flex material surface area is accomplished via a single-step process enabling a rate of 80–120 units per hour (UPH).

The FlexVIA System does not require heating or cooling, therefore; the system does not require additional temperature control or a blower, which further maximizes the system’s cost effectiveness.

It also does not require the use of expensive fluorine gases. Instead, environmentally friendly and cost effective gas plasma solutions such as Argon (Ar) and Oxygen (O2) are utilized.

Easy to Use

The FlexVIA Plasma System makes it easy to load various sizes of flexible materials into the chamber via two, optimum height, front-loading doors. Convenient carts smoothly slide the racks in and out of the system. The loading racks include versatile slide out trays to accommodate many different flexible material sizes. The system is controlled by an intuitive touch screen GUI with a one-button start feature.

Innovation and Applications

The FlexVIA System further builds on the success of the Nordson MARCH VIA™ line of products (ProVIA™, MaxVIA™, RollVIA™) which incorporate innovative application-specific technology with over 25 years of experience in plasma treatment for the PCB industry.

The FlexVIA System has been recognized with two awards in 2013: the New Product Introduction award from Circuits Assembly magazine, and the EM Asia-China Innovation award for surface treatment of flexible PCBs.

The primary plasma application is surface treatment of inner layer flex, prior to lamination, for improved adhesion and reliability.

Features and Benefits

  • Efficient design, economical gas consumption, small footprint, and attractive system pricing all contribute to a low cost of ownership
  • Easy loading and versatile horizontal racks allow for maximum throughput
  • Single stage plasma process and capacity for up to (18) 20” x 24” panels per cycle, enabling a rate of 80 – 120 units per hour (UPH)
  • Patented, industry-proven plasma technologies provide superior surface treatment uniformity, prior to lamination, to improve adhesion and reliability of flexible material

Related Solutions

Carbon Removal
Nordson MARCH's plasma cleaning technology removes the carbon from conventional through-hole board vias & blind vias typically used on boards where component space is restricted.

Desmear & Etch Back
Nordson MARCH's plasma treatment technology removes epoxies, polyimides, high Tg blends, mixed materials & other resins more effectively than traditional methods of etching and desmearing

Inner Layer Preparation
Plasma treatment technology from Nordson MARCH alters the topography & wettability of cover-coated inner board layers, promoting adhesion by allowing thin layer processing using flex clips

Non-Stick Surface Activation
Use plasma technology from Nordson MARCH for surface activation of double-sided and multi-layer fluoropolymer through-hole boards to increase surface wettability.

Residue Removal (Descum)
Nordson MARCH's plasma technology effectively removes resist residue from inner layers and panels as well as residual solder mask bleed for better bonding and solderability

Related Products

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