Suitable for the majority of applications not requiring additional flux features to make a quality solder joint.
Typical Applications include Surface Mount Technology (SMT), Electrical Components and Electro-Mechanical Components.
Flux Types available: No Clean, Water Soluble, Rosin Activated and Rosin Mildly Activated.
SolderPlus Dispense Formulation
Additional Features
FluxPlus™ Flux Formulation
Flux Class
NC, 5X0, or D500
Standard
6-412
ROL0
NCLR or D501
Low-residue
6-412
ROL0
RMA, 2X0 or D200
Standard
6-411
ROL0
RA, 3X0 or D300
Standard
6-410
ROM0
WS, 4X0 or D400
Standard
6-415
ORL0
WS44 or D440
Alloy Liquidus
Temperature >200°C
6-416
ORM1