Enhanced Wetting

Suitable for applications needing good spread across an area larger than the solder paste deposit and/or wetting to moderately oxidized surfaces and moderately difficult-to-solder metals.

Typical Applications include older, oxidized SMT and through-hole components, and Alloy42 leaded devices.

Flux Types available: No Clean, Water Soluble, Rosin Mildly Activated and Rosin Activated.

SolderPlus Dispense Formulation
Additional Features
FluxPlus™ Flux Formulation
Flux Class
NCLR or D501
Low Residue
6-412
ROL1
D502
Extended Reflow
6-412
ROL1
RMA21
Increased Activity
n/a
ROL0
RA31 or D310
Increased Activity
6-410
ROM1
WS44 or D440
High Temperature
6-416
ORM1

 

 

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