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The Technical Papers have been grouped into the following categories:
Printed Circuit Board Assembly (PCBA)
Semiconductor Inspection & Assembly
Printed Circuit Boad Assembly (PCBA)
3D Board Level X-ray Inspection via Limited Angle Computer Tomography
Use of digital X-ray imaging as a process control tool for lead-free PWB assembly
Lead-free Inspection Methods
Does PCB Pad Finish affect voiding levels in lead-free assemblies
Computerized Tomography meets the challenges of X-ray inspection
Correlating the presence of popcorned BGA devices post reflow with solder ball diameter measurements from X-ray Inspection
Common process identification of QFN packages using Optical and X-ray inspection
Consideration for minimizing radiation doses to components during X-ray inspection
Selection criteria for X-ray inspection systems for BGA and CSP solder joint analysis
Modern 2D X-ray tackles BGA defects
Comparing Digital and Analogue X-ray inspection for BGA, Flip Chip and CSP analysis
Investigating voids
Quality and reliability of Printed Circuit Boad micro-vias by X-ray inspection
Non-destructive techniques for identifying defect in BGA joints; TDR, 2DX and cross-section/SEM comparison
Modern 2D/3D X-ray inspection - emphasis on BGA, QFN, 3D packages and counterfeit components
Semiconductor Inspection and Assembly
The challenge of Package on Package (PoP) devices during Assembly and Inspection
X-ray inspection for nano-technology
X-ray Technology
A-Z of X-ray inspection
Advances in X-ray tube technology
Aerospace & MilitaryXD7500NT950HPXD7800NT950HP for larger boards
Computer TomographyCT optionFailure Analysis and Laboratory workXD7600NT500PCB AssemblyXD7500NT950XD7800NT950 for larger boardsSemiconductor and high technology applicationsXD7600NT100HPXD7800NT100HP for larger boards