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Bondtesting of Overhanging Die
Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests
NEW - MATERIALS TESTING FOR MICROELECTRONICS - article published in US Tech February 2013
High Speed Solder Ball Shear and Pull Tests vs Board Level Mechanical Drop Tests
Solar Cell Bondtesting
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