Sealing Dispensing for
MEMS Wafer Capping
Wafer capping MEMS devices presents challenges and specific requirements for dispensing sealant, volumetric accuracy, and motion systems that can be met with the correct dispensing equipment and methods.
Continuous Path Motion
New device configurations change the amount of fluid needed for underfill and the dispensing techniques for depositing it. Using a continuous motion avoids backtracking and improves units per hour by 27%.
Selective coating coats specific areas. Using properly characterized automated equipment is a reliable way to increase yield, throughput, and reduce the cost of the conformal coating process.
Process Improvements in
Speed and throughput have increased exponentially over the years, yet are still factors challenging the exisiting dispensing systems as fast never seems to be fast enough. Increasing throughput involves more than just speeding up the actual act of dispensing.