BGA Solder Ball Reinforcement from Nordson ASYMTEK

BGA Solder Ball Reinforcement

Simple method to improve solderball reliability by applying a polymer around the balls prior to assembly.

Polymer materials are applied around solder balls to improve the reliability of area array devices, like BGAs, that are not underfilled. Jet dispensing of polymer material provides an excellent method of applying just the right amount of material around the balls.
 
Exact amounts of material can be deposited between solder balls, but typically coverage of the ball ranges from 25% to 75%.

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