3D Packaging

Dispensing applications for stacked dies with outer-edge interconnection , stacked dies with through silicon vias (TSV) and face-to-face stacked dies

3D Packaging is a hot subject in the microelectronics packaging world. Because there are limited standards in this segment of the industry, each manufacturer has their own method of accomplishing a stacked structure. 3D packaging typically falls into three categories: stacked dies with interconnections on the outer edge (a replacement for wire bonding), stacked dies with through-siliconvias (TSV), and face-to-face stacked dies.

Nordson ASYMTEK has successfully demonstrated capability to dispense on stacked dies with outer edge interconnects; where a small, narrow line of conductive material is dispensed on the stack to form an electrical connection between the dies and a package substrate.

Nordson ASYMTEK’s customers also dispense capillary underfill for stacked dies with TSV after the stacking process: such that all of the gaps between dies are filled at the same time. Similarly, face-to-face stacked dies also require underfill dispensing.

Nordson ASYMTEK is partnering with market leaders for several silicon die stacking projects. If you need adhesive application as part of your 3D assembly, please contact Nordson ASYMTEK.

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Akira Morita     
Semiconductor Packaging      Market Specialist